联系方式

010-67396614

研究方向

先进电子封装材料与技术；互连焊点可靠性；晶体取向对焊点可靠性影响；焊点界面反应等。

教育经历

2002/09-2006/07，哈尔滨工业大学，焊接技术与工程，工学学士

2006/09-2008/07，哈尔滨工业大学，材料加工工程，工学硕士

2008/09-2013/01，哈尔滨工业大学，材料加工工程，工学博士

研究与工作经历

2018/07至今，北京工业大学材料学院，副教授

2013/08-2018/07，北京工业大学材料学院，讲师

科研项目

2015/01-2017/12国家自然科学基金青年基金

2016/01-2018/12北京市自然科学基金面上项目

2017/01-2019/12北京市教委科技计划一般项目

发明专利

[1]汉晶,谷朋浩,郭福.一种BGA用纳米颗粒强化焊锡球制备方法.授权号: ZL201610320076.1.

[2]汉晶,谷朋浩,郭福.实验室BGA用纳米强化焊锡球及抗热疲劳BGA封装器件的制备方法.授权号:ZL201610534736.6.

论文

[1] J. Han, F. Guo, J.P. Liu. Early stages of localized recrystallizationin Pb-free BGA solder joints subjected to thermomechanical stress. Journal ofAlloys & Compounds, 704 (2017) 574-584.

[2] J. Han, F. Guo, J.P. Liu. Recrystallization induced by subgrainrotation in Pb-free BGA solder joints under thermomechanical stress. Journal ofAlloys & Compounds, 698 (2017) 706-713.

[3] J. Han, F. Guo. Nucleation and electromigration-induced grainrotation in an SABI333 solder joint. Journal of Materials Science, 53 (2018)6230-6238.

[4] J. Han, F. Guo, J.P. Liu. Effects of anisotropy of tin on grainorientation evolution in Pb-free solder joints under thermomechanical stress.Journal of Materials Science Materials in Electronics, 28 (2017) 6572-6582.

[5] J. Han, F. Guo. Effects of impurities on double twinning nucleation andgrain refinement of Sn-based solder joints. Journal of Materials ScienceMaterials in Electronics, 29 (2018) 8031-8038.

[6] J. Han, J. Sun, F. Guo. Recrystallized grain rotation behavior in aPb-free BGA solder joint under electron current stress. Journal of MaterialsScience Materials in Electronics, 29 (2018) 6266-6273.

[7] J. Han, J. Sun, T. Wen, F. Guo. Dependence of grain orientation inSABI333 solder joints on solidification temperature. Journal of MaterialsScience Materials in Electronics, 29 (2018) 1-10.

[8] J. Han, J. Sun, F. Guo. Analysis of continuous recrystallization(sub)grain rotation behavior in Pb-free solder bumps under a 0.1µm/s shear rate. Journal of MaterialsScience Materials in Electronics, 29 (2018) 10992-10999.

[9] J. Han, P.H. Gu, L.M. Ma, F. Guo, J.P. Liu. Recrystallization Behaviorin SAC305 and SAC305+3.0POSS Solder Joints Under Thermal Shock. Journal ofElectronic Materials, 47 (2018) 2479-2487.

[10] J. Han, S.H. Tan, F. Guo. Study on subgrain rotation behavior atdifferent interfaces of a solder joint during thermal shock. Journal ofElectronic Materials, 45 (2016) 6086-6094.

[11] J. Han, S.H. Tan, F. Guo. Subgrain rotation behavior in theSn3.0Ag0.5Cu-Sn37Pb solder joints during thermal shock. Journal of ElectronicMaterials, 47 (2017) 124-132.

[12] J. Han, Y. Wang, S.H. Tan, F. Guo. Effects of Grain Orientation on Cu₆Sn₅Growth Behaviors for Cu₆Sn₅Reinforced Composite SolderJoints During Electromigration. Journal of Electronic Materials, 47 (2018)1705-1712.