基本信息

宇慧平，工学博士，北京工业大学材制学部力学系，副教授，硕士生导师。主持完成北京自然科学基金1项，北京市教委项目1项，以及多项企事业科研项目，参与完成多项国家自然科学基金及企事业科研项目，发表科研论文40余篇，其中SCI、EI检索20多篇，合作专著1部。

研究方向

[1]复杂工程问题的数值仿真、优化与可靠性分析

[2]疲劳损伤与寿命预测

[3]电子封装中的工艺仿真与优化

近几年部分期刊论文

[1]Huiping Yu, Yubo Guo, Yanpeng Gong, Fei Qin. Thermal analysis of electronic packaging structure using isogeometric boundary element method[J]. Engineering Analysis with Boundary Elements, 2021, 128:195-202.

[2] H. P. Yu, Z. H. Tong，P. Chen, A. W. Cai, F. Qin, Effects of Different Parameters on Thermal and Mechanical Properties of Aminated Graphene/Epoxy Nanocomposites Connected by Covalent: A Molecular Dynamics Study, Current Applied Physics. 20 (4) (2020) 510–518.（WOS：000516771300006）

[3]宇慧平,皮本松,陈沛,秦飞.交联环氧树脂热力学性能的分子模拟.北京工业大学学报，2019,45(4): 322-329

[4]元月,宇慧平,秦飞等.热像仪标定QFN封装表面发射率及透射率的研究.激光与红外,2017: 46(9), 0917004（1-5）

[5] Huiping Yu, Mingqing Hu, Yuehua Liu. Analysis of the effect of geometrical parameters on fatigue performance of spot-weld joint for ultra-high strength steel. China Welding, 2016,25(4):12-25

[6]宇慧平,冯峰.过载拉伸消除奥氏体不锈钢焊接残余应力的数值分析.焊接学报,2016,37(8):119-123

[7]宇慧平,元月.不同工艺下超高强钢点焊残余应力的试验分析.焊接学报,2016,37(9):35-38.

[8]王晓光,宇慧平.超高强钢点焊结构疲劳试验分析.焊接学报,2016,37(2): 99-102.

[9]宇慧平,王伟伟.基于响应面法的超高强钢点焊结构的尺寸优化.焊接学报,2014,35(4):45-48.

[10]宇慧平,王伟伟.超高强钢点焊结构拉剪试验及数值仿真.焊接学报, 2013, 34(10):9-12.

近几年部分国际会议论文

[1]Yubo Guo, Huiping Yu, Yanpeng Gong, Fei Qin. Thermal analysis of IGBT by isogeometric boundary element method[C]. Proceedings of the 21st International Conference on Electronic Packaging Technology (ICEPT 2020), Guangzhou, China, Aug. 2020. (EI20204309396677)

[2] Bensong Pi, Huiping Yu, Pei Chen, Fei Qin.Thermal conductivity of epoxy resin using molecular dynamics simulation. ICEPT 2018:995-999

[3] Shichao Yuan, Huiping Yu, Ming Xian, Fei Qin. Simulation research on wafer warpage and internal stress in the First Passivation process of eSiFO package. ICEPT 2018:990-994

[4] Yue Yuan, Huiping Yu. QFN cutting temperature measurement basing on the infrared thermal imager. ICEPT 2017: 1073-1077

[5] Huiping Yu, Mingqing Hu. Analysis the interface delamination of Cu and EMC adhesive material in the cutting process of electronic chip based on cohesive zone modeling. ICEPT 2016: 943-946

[6] Huiping Yu, Feng Feng.Numerical Analysis and Parameter Optimization of Thermal Stress Effect for Low-K Layer Flip-Chip with Copper Pillar Bumping. ICEPT 2015

[7] HuiPing Yu, MingQing Hu.The Experimental study of Quenched and Unhardened Boron B1500HS.2014 International Conference on Mechanics and Materials Engineering: 722-726