Education
B.S. Materials Science and Engineering, Beijing University of Technology (BJUT), 1994
M.S. Materials Science and Engineering, Beijing University of Technology (BJUT), 1997
Ph.D. Materials Science and Engineering, Michigan State University (MSU), 2001
Research Biography
Advanced interconnect materials for microelectronic packaging; reliability of electronic packages; advanced thermoelectric materials; recycling of e-waste, etc.
Selected Publications
1. Juanjuan Hao, Yishu Wang, Yufeng Wu, andFu Guo, Metal recovery from waste printed circuit boards: A review for current status and perspectives. Resources, Conservation and Recycling, 2020, 157: 104787.
2. Yu Tian, Limin Ma, Yishu Wang,Fu Guo, Zhijie Sun, The Growth of Interfacial IMC Layer in SAC0307 Solder Joints with Specific Grain Orientation Under Electrical and Thermal Coupling Fields, Journal of Electronic Materials, 2019, pp1-10;
3. Jing Han,Fu Guo, Double tricrystal nucleation behavior in Pb-free BGA solder joints, Microelectronics Reliability, 2019, vol 98, pp1-9;
4. Yutian Shu, Ran Zhao,Fu Guo, Improvement of thermoelectric properties via combination of nanostructurization and elemental doping. JOM, 2014, 66(11): 2298-2308.
5.Fu Guo, M. Zhao, Z. Xia, Y. Lei, X. Li, and Y. Shi, Lead-free solders with rare earth additions , JOM 61(6), 39(2009)
6.Fu Guo, Guangchen Xu, and Hongwen He, “Electromigration behaviors in Sb particle-reinforced composite eutectic SnAgCu solder joints”, Journal of Materials Science, 44(20), 5595(2009).
7.Fu Guo, Guangchen Xu, Jia Sun, Zhidong Xia, Yongping Lei, Yaowu Shi, and Xiaoyan Li, “Resistance changes in eutectic SnBi solder joints during electromigration,” Journal of Electronic Materials, 38(12), 2756(2009).
8.Fu Guo, Composite lead-free electronic solders , J Mater Sci: Mater Electron, volume 18, Numbers 1-3, ISSN 0957-4522 March 2007, pp.129
9. K.F. Hsu, S. Loo,F. Guo, W. Chen, J. S. Dyck, C. Uher, T. Hogan, E. K. Polychroniadis, M.G. Kanatzidis, “Cubic AgPbmSbTe2+m: Bulk Thermoelectric Materials with High Figure of Merit”, Science, 303, 818 (2004).
10. J.R. Salvador,F. Guo, T. Hogan, and M.G. Kanatzidis, “Zero Thermal Expansion in YbGaGe due to an Electronic Valence Transition”, Nature, 425, 704 (2003).
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Personal Biography
Professor Fu Guo earned his Ph.D. degree in Materials Science and Engineering from Michigan State University (MSU) in 2001 and served as a postdoctoral research associate at MSU from 2001 to 2003. He joined the BJUT faculty in 2003 and became a full professor in 2004.
As a materials science professor, Dr. Guo serves as PI for several national and municipal level research projects. His main research areas include materials processing engineering, reliability study of electronic packaging materials and structures, and thermoelectric materials for cooling and power generation applications. He has more than 120 publications in many international high-level scientific journals including Science, Nature, Advanced Materials, Journal of American Chemical Society, etc. He has published the first monograph on Lead-free Soldering Technology and Application in China, and the globally invited paper on Composite Electronic Solders in the Journal of Materials Science: Materials in Electronics, and on Thermoelectric Materials in JOM.
Dr. Guo has won many awards and titles, such as MSU Outstanding Academic Achievement Award, Fok Ying-tung Young Teachers Award, MOE New Century Excellent Talent, National Excellent Educator title, Capital Excellent Educator title, Capital May 4th Youth Medal, Capital Labor Medal, First Prize of Beijing Teaching and Education Achievement Award, etc.
Dr. Guo is now the chair of Beijing Industrial Promotion Association for Advanced Carbon Materials and a board member of China Association of Higher Education. He has been serving as member of the 15th Beijing Municipal People’s Congress since 2017. He used to serve as the chair of China Materials Society Youth Committee, chair of Manufacturing Technology Committee of Beijing Electronic Society and chair of TMS Electronic Packaging and Interconnect Materials Committee. Before becoming Vice President, Dr. Guo has served as Director of Faculty of Materials and Manufacturing, Dean of College of Materials Science and Engineering, Director of Academic Affairs Office, Director of Undergraduate Admissions Office and Dean of Fan Gongxiu Honors College at BJUT.
Official Website Info
Dr. Guo Fu, member of the Communist Party of China (CPC), professor and Ph.D. supervisor, was born in October 1971, in Beijing. He obtained his bachelor and master degree in Materials Science and Engineering from Beijing University of Technology in 1994, and 1997, Ph.D. degree in Materials Science and Engineering from Michigan State University in 2001. He previously worked as director of University Academic Affairs Office, director of University Undergraduate Admissions Office, dean of Fan Gongxiu Honors College, deputy CPC Secretary and dean of the College of Materials Science and Engineering, and director of Faculty of Materials and Manufacturing. In November 2019, Dr. Guo was appointed as Vice President of BJUT.
Dr. Guo’s research interests include advanced interconnection materials in electronic packaging, alloying and composite approaches in lead-free solder development, reliability characterization of solder joint, thermoelectric materials, etc. He has PI-ed and participated more than 20 national and provincial level projects and published more than 100 papers on archival journals, such as Science, and Nature. Dr. Guo has taken the lead in teaching several state-level model bilingual courses and municipal-level quality courses and has won many teaching awards, including the Beijing Teaching and Educational Achievement Award, etc. In 2017, Dr. Guo was elected as a member of the 15th Beijing Municipal People’s Congress. In 2019, he was awarded the title of National Excellent Educator of China. Dr. Guo has received many other honorary titles, such as the Education Reform and Innovation Pioneer of China, Excellent CPC Member of Beijing, Excellent Educator of Beijing, and Capital Medal, etc.
He oversees human resources, high-level talents, international exchange and cooperation, university outreach, alumni, and continuing education of the university, including the Human Resources Office, High-level Talents Office, International Exchange and Cooperation Office, Party Committee and Student Affairs Department (Student Affairs Office, People’s Armed Forces Department), Advising Center for Student Development, Career and Entrepreneurship Center, Graduate Student Affairs Department, Youth League Committee, and University Outreach Office. He supervises the College of International Education, Beijing-Dublin International College, and the College of Continuing Education.
官网介绍
郭福，男，1994年本科毕业、1997年硕士毕业于北京工业大学金属材料科学与工程学系。从1997年起赴美国留学，于2001年11月在美国密歇根州立大学获得材料科学与工程专业的博士学位。2001年12月开始在美国密歇根州立大学电子与计算机工程系电子材料实验室进行博士后研究工作。
2003年8月回国，于2003年9月起在北京工业大学材料学院任教，2004年1月起任教授，2004年5月任博士生导师。曾任材料学院党委副书记、教务处处长、招生办公室主任、樊恭烋荣誉学院院长、材料科学与工程学院院长、材料与制造学部主任。2019年11月起任北京工业大学党委常委、副校长。目前是北京市第十五届人大代表。
在美国留学及工作期间，作为美国国家科学基金、海军科研办公室等研究项目的主要参与者及国内各类重点研发项目的主持者，在国外核心刊物上发表学术论文百余篇，其中2篇文章分别在美国知名杂志Science及英国知名杂志Nature上发表。2001年获得美国密歇根州立大学工程院颁发的最佳学术成果奖。2004年入选北京市科技新星计划及教育部新世纪优秀人才支持计划。2006年获得霍英东基金和北京市青年“五四奖章”。2012年获得北京市教育教学成果奖一等奖。2013年获得第三届全国教育改革创新先锋教师奖。2014年获得北京市师德标兵。2016年获得北京市优秀共产党员。2017年获得首都劳动奖章、北京市优秀教育工作者。2018年获得北京市教育教学成果奖一等奖。2019年获得全国优秀教育工作者。
目前承担国家自然科学基金、国家重点研发项目、北京市科技计划项目、北京市自然科学基金等多项研究工作。曾任中国材料研究学会青年委员会副秘书长、副主任、主任，北京市电子学会生产技术专业委员会主任委员，美国TMS学会电子组装及连接材料专业委员会秘书、副主任、主任。现任北京先进碳材料产业促进会会长、北京工业大学校友总会理事长、教育基金会理事长。主要研究方向为微电子封装用新型连接材料无铅钎料及新型能源材料热电材料的研究。
Research is seeing what everybody else has seen and thinking what nobody else has thought.
Analyzing the detrimental effects of the mass transport under high current density. Understanding how thermoelectric power factors balance the best. Exploring new noble metal leaching solutions from waste printed circuit boards. Pushing the boundaries of solder joint life span. Producing new and inspiring interconnects for smart vehicle electronics. These are just a small sampling of the different types of research and creative activities taking place at our lab on a daily basis.
Research and creative activity is about discovery. It’s about having an idea and finding the right environment in which to explore that idea. At our Lab of Electronic Packaging Research, we take great pride in our ability to provide supportive environments for the exploration of all types of ideas. Our collaborative and interdisciplinary efforts by student and faculty researchers aim to gain new knowledge and pursue new discoveries in improving society and helping drive human advancement.
You are invited to join us! Please send usemailsor fill out theformfor further inquiries.
