代表性成果与荣誉
发表的论文:
Can Wang, Daibo Zhu*, Wenming Zhu, Hailin Liu, Xinyan Liu, Xiaoyu Jiang, Fan Zhou*, Yanbin Jiang, Xiaochen Ding, Tao Deng. Comprehensive analysis of beryllium content influence on secondary electron yield in Cu-Be alloys. Mater. Charact. 2024, 218, 114553.
Rui Wang, Fan Zhou*, Jinshu Wang*, Yunfei Yang, Wei Liu. Enhanced secondary electron emission properties of Zn doped MgO thin films prepared by aerosol assisted chemical vapor deposition. Mat. Sci. Semicon. Proc. 2023, 157, 107323.
周帆*, 王蕊, 梁轩铭, 刘伟, 王金淑. MgO薄膜次级电子发射材料研究现状与展望. 北京工业大学学报. 2020, 46(10), 1128-1138.
梁轩铭, 周帆*, 王金淑, 王蕊, 杨韵斐, 邓琦键. ZnO增强MgO薄膜的次级电子发射性能实验和理论研究. 真空科学与技术学报. 2020, 40(9), 853-861.
Fan Zhou, Quan Zhang, Feifei Wang, Jing Wang, Yunfei Yang, Chen Lai, Wei Liu, Jinshu Wang*. Surface characterization and secondary electron emission properties of alumina containing MgO film on Ag-Mg-Al alloy. Metals. 2018, 8(8), 570.1-13.
Feifei Wang, Fan Zhou*, Jinshu Wang*, Quan Zhang, Wei Liu, Qiao Yin. Characterization of MgO/Al2O3 composite film prepared by DC magnetron sputtering and its secondary electron emission properties. Journal of Electronic Materials, 2018, 47(7), 4116-4123.
Chen Lai, Jinshu Wang, Fan Zhou*, Wei Liu, Naihua Miao. Reduction, sintering and mechanical properties of rhenium-tungsten compounds, J. Alloy. Compd., 2018, 735, 2685-2693.
Chen Lai, Jinshu Wang*, Fan Zhou, Wei Liu, D. den Engelsen, Naihua Miao, Emission and Evaporation Properties of 75at% Re-25at% W Mixed Matrix Impregnated Cathode. Appl. Surf. Sci., 2018, 427, 874-882.
Chen Lai, Jinshu Wang*, Fan Zhou, Wei Liu, Peng Hu, Changhao Wang, Ruzhi Wang, Naihua Miao. Preparation and surface characteristics of Re3W matrix scandate cathode experimental and theoretical study. Appl. Surf. Sci., 2018, 440, 763-769.
Quan Zhang, Jinshu Wang*, Fan Zhou*, Wei Liu, Feifei Wang, Chen Lai. Influence of activation parameters on the thickness of MgO thin film on Ag-3Mg alloy and its secondary electron emission property. Mate. Res. Bull., 2017, 96, 35-39.
出版的著作:参与编写《钨基材料制备技术及应用》. 冶金工业出版社. 北京. 2024