教育与工作经历
2010-2015年,美国德克萨斯大学阿灵顿分校,材料系,博士学位;
2007-2010年,北京科技大学,材料物理与化学系,硕士学位;
2003-2007年,大连理工大学,金属材料工程系,本科学位。
代表性成果
发表的论文(部分):
(1) Effect of Sn grain c-axis on Cu atomic motion in Cu reinforced composite solder joints under electromigration, Journal of Electronic Materials, 2020.03;
(2) Effect of grain boundary on failure behavior of SABI333 solder joints during creep, Journal of Materials Science: Materials in Electronics, 2020.03;
(3) Metal recovery from waste printed circuit boards: A review for current status and perspectives, Resources Conservation and Recycling, 2020.06;
(4) Research Advances and Prospect of Low- Temperature Sn- xBi- yM Alloy Solders for Microelectronic Packaging, RARE METAL MATERIALS AND ENGINEERING, 2024. 04;
(5) Stable SnAgCu solder joints reinforced by nickel-coated carbon fiber for electronic packaging, Engineering Fracture Mechanics, 2024. 08.