公颜鹏  

电子封装技术与可靠性研究所

公颜鹏

 

基本信息: 

姓名:公颜鹏
性别:

学位:博士

邮箱:yanpeng.gong@bjut.edu.cn

 

留学经历:

2017年11月-2018年11月,英国杜伦大学工程系,博士联合培养。

 

主要研究方向:

1 计算固体力学;

2 电子封装中的力学问题;

2 等几何分析方法;

3 边界元法。

 

主要科研项目:

1 北京工业大学基础研究基金项目“功率循环条件下IGBT封装模块中界面破坏分析的等几何边界元法研究”,2020.1-2021.12。

2 北京市博士后科研活动资助-创新研发类(A类)“IGBT封装模块温度/应力分析的等几何边界元法研究”,2020.6-2021.6。

3 北京市教委科研计划科技一般项目“多层、跨尺度IGBT封装模块界面破坏分析的等几何边界元法研究”,2021.1-2023.12。

4 国家自然科学基金青年项目“跨尺度多层结构热应力分析的等几何边界元法研究”2021.1-2023.12.

 

主要学术成果:

[1] F Qin, L Zhang, P Chen, T An, Y Dai, Y Gong, Z Yi, H Wang, In situ wireless measurement of grinding force in silicon wafer self-rotating grinding process, Mechanical Systems and Signal Processing 154 (2020) 107550. (SCI, TOP)

[2] FL Sun, YP Gong, CY Dong, A novel fast direct solver for 3D elastic inclusion problems with the isogeometric boundary element method, Journal of Computational and Applied Mathematics 377 (2020) 112904. (SCI, TOP)

[3] F Qin, Y Hu, Y Dai, T An, P Chen, Y Gong, H Yu, Crack Effect on the Equivalent Thermal Conductivity of Porously Sintered Silver, Journal of Electronic Materials 49 (10) (2020) 5994-6008. (SCI)

[4] Y Guo, H Yu, Y Gong, F Qin, Thermal analysis of IGBT by isogeometric boundary element method, 2020 21st International Conference on Electronic Packaging Technology (ICEPT).

[5] Y.P. Gong, C. Dong, F. Qin, G. Hattori, J. Trevelyan, Hybrid nearly singular integration for three-dimensional isogeometric boundary element analysis of coatings and other thin structures, Computer Methods in Applied Mechanics and Engineering 367 (2020) 113099. (SCI, TOP)

[6] F.L. Sun, C.Y. Dong, Y.H. Wu, Y.P. Gong, Fast direct isogeometric boundary element method for 3D potential problems based on HODLR matrix, Applied Mathematics and Computation 359 (2019) 17-33. (SCI, TOP)

[7] Y.P. Gong, J. Trevelyan, G. Hattori, C.Y. Dong, Hybrid nearly singular integration for isogeometric boundary element analysis of coatings and other thin 2D structures, Computer Methods in Applied Mechanics and Engineering 346 (2019) 642-673. (SCI, TOP)

[8] Y.P. Gong, H.S. Yang, C.Y. Dong, A novel interface integral formulation for 3D steady state thermal conduction problem for a medium with non-homogenous inclusions, Computational Mechanics 63(2) (2019) 181-199. (SCI)

[9] X.Y. Qu, C.Y. Dong, Y. Bai, Y.P. Gong, Isogeometric boundary element method for calculating effective property of steady state thermal conduction in 2D heterogeneities with a homogeneous interphase, Journal of Computational and Applied Mathematics 343 (2018) 124-138. (SCI, TOP)

[10] Y.P. Gong, C.Y. Dong, X.Y. Qu, An adaptive isogeometric boundary element method for predicting the effective thermal conductivity of steady state heterogeneity, Advances in Engineering Software 119 (2018) 103-115. (SCI)

[11] Y.P. Gong, C.Y. Dong, X.C. Qin, An isogeometric boundary element method for three dimensional potential problems, Journal of Computational and Applied Mathematics 313 (2017) 454-468. (SCI, TOP)

[12] Y.P. Gong, C.Y. Dong, An isogeometric boundary element method using adaptive integral method for 3D potential problems, Journal of Computational and Applied Mathematics 319 (2017) 141-158. (SCI, TOP)

[13] Y.P. Gong, C.Y. Dong, Y. Bai, Evaluation of nearly singular integrals in isogeometric boundary element method, Engineering Analysis with Boundary Elements 75 (2017) 21-35. (SCI)

[14] X.C. Qin, C.Y. Dong, F. Wang, Y.P. Gong, Free vibration analysis of isogeometric curvilinearly stiffened shells, Thin-Walled Structures 116 (2017) 124-135. (SCI)

[15] Y.M Zhang, Y.P. Gong, X.W. Gao, Calculation of 2D nearly singular integrals over high-order geometry elements using the sinh transformation, Engineering Analysis with Boundary Elements 60 (2015) 144-153. (SCI)

[16] X.C. Li, Y.M. Zhang, Y.P. Gong, Y. Su, X.W. Gao, Use of the sinh transformation for evaluating 2D nearly singular integrals in 3D BEM, Acta Mechanica 226 (2015) 2873-2885. (SCI)

 

个人自述:

公颜鹏,工学博士,山东省淄博籍。2019年6月毕业于北京理工大学宇航学院力学系。主要研究领域有计算固体力学,等几何分析方法以及电子封装中的力学问题。到目前为止,共发表SCI论文16篇(其中8篇为TOP期刊)。2019年“北京市优秀毕业生”获得者。2019年加入电子封装技术与可靠性研究所,针对当前国家需求,结合自己特长和研究所资源,对电子封装中的力学问题展开研究。

欢迎对数值计算、编程、数学、力学、计算机软件、计算机图形学等感兴趣的同学加入!

北京工业大学研究生招生办公室 地址:北京市朝阳区平乐园100号 邮政编码:100124 联系电话:010-67392533